2013光互连的机遇 市场和技术预测第二卷

        中文：《光互连的机遇：市场和技术预测--2013-2020》（第二卷：On-Chip和Chip-to-Chip）
        英文：Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013-2020（Volume II: On-Chip and Chip-to-Chip）
发布时间：2013年7月

        报告简介

        近年来，关于集成电路（IC）制造的传统架构和材料方面的假设受到挑战，半导体行业则正在寻找新的解决方案。此外，半导体行业的能源和散热问题使得这一危机更加凸显。

        其中最重要的问题之一就是所谓的“互连瓶颈”，即On-Chip和Chip-to-Chip都会同时出现的数据流量堵塞趋势。互连瓶颈在摩尔定律完全失去动力的很久以前就已经出现，它现在是以不同的形式重新出现在为使芯片封装更容易的新的架构中。

        “明显的”解决方案是采用光学这一解决带宽问题常用的方式。但是针对On-Chip和Chip-to-Chip互连的光学解决方案在商用产品的开发方面比较困难。生产能被用在芯片层级的足够小和低廉的光子器件是一个很大的难题。

        在这份报告中，CIR分析了光互连在芯片层级的最新发展以及世界各地的重要研究小组在这个领域取得的进展。报告同时讨论了研发和商用方面的进展。该报告从传统CPU芯片以及最新架构的角度来看待这个问题，同时还分析了相对于金属互连和未来可能出现的其它比光子更奇特的替代解决方案（尤其是碳纳米管）而言，光互连所存在的发展机遇。

        报告里面还包括了未来十年的演进路线图。该路线图展示了芯片层级光互连商业机会的出现时机、应用领域及其市场规模。CIR还分析了领导厂商及其在设计和实施On-Chip & Chip-to-Chip光互连方面的研究工作。

        参考目录

        Executive Summary
        执行者摘要

E.1 Opportunities and Business Models for Photonics Firms
E.2 How the Semiconductor Industry Will Use Optical Interconnection as an Enabling
Technology
E.3 Summary of Key R&D Directions for On-Chip and Chip-to-Chip Optical Interconnection
E.4 Eight Companies and Other Organization that Will Create Photonic Interconnection for
Chip-Level Interconnection
E.5 Roadmap and Summary 10-year Forecast for Chip Level Interconnection

Chapter One: Introduction
第一章：报告简介
1.1 Background to this Report
1.2 Objective and Scope of this Report
1.3 Methodology of this Report
1.4 Plan of this Report

Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection
第二章：On-Chip & Chip-to-Chip互连需求分析
2.1 Limits to Electronic Interconnects
2.2 Moore’s Law, Scaling and Interconnection
2.2.1 Current Prognosis for Moore’s Law
2.2.2 Impact on Interconnection
2.3 Multi-Core Processors Breed New Interconnection Problems
2.4 So Do 3D Chips
2.5 Potential for Moving to Non-Silicon Chips: Carbon Nanotubes, Graphene, Quantum Dots
2.5.1 Impact on Interconnection
2.6 A Possible Transition to Optical Computing
2.6.1 Impact on Interconnection
2.7 Key Points Made in this Chapter

Chapter Three Technologies for On-Chip/Chip-to-Chip Interconnection
第三章：On-Chip & Chip-to-Chip互连的三种技术
3.1 Current Optical Assemblies for Chip-to-Chip Interconnection
3.2 Emerging Laser Technology for Chip-Based Interconnections
3.2.1 VCSELs
3.2.2 Quantum Dot Lasers
3.2.3 Other Technologies
3.3 Emerging Detector Technology for Chip-Based Interconnection
3.4 Emerging Modulator Technology for Chip-Based Interconnection
3.5 Ten-Year Road Map and Revenue Forecast for Chip-Based Optical Interconnection
3.6 The Role of Optical Integration in Future Chip-Based Interconnection
3.6.1 Silicon Photonics
3.6.2 Indium Phosphide and Other Inorganic Semiconductors
3.6.3 The Role of Polymer Waveguides in Chip-Based Interconnection
3.6.4 Ten-Year Road Map and Revenue Forecast for Optical Integration in Chip-Based Optical
Interconnection
3.7 Other Alternatives to Optics for Advanced Interconnection
3.7.1 Carbon Nanotubes
3.7.2 Other
3.8 Key Points Made in this Chapter

    附：《光互连的机遇：市场和技术预测--2013-2020》（第一卷：板对板和机架到机架）